Hubei Fotma Machinery Co., Ltd.
Tungsten, Molybdenum, Titanium, Tungsten Carbide and Investment Casting Products
| Place of Origin: | P.R. China |
|---|---|
| Brand Name: | FOTMA |
| Certification: | ISO9001:2008 |
| Model Number: | WCu Tablets |
| Minimum Order Quantity: | 1 pcs |
| Price: | Negotiable |
| Packaging Details: | Paper cartons or plywood boxes |
| Delivery Time: | 20-25 days after deposit |
| Payment Terms: | T/T, L/C, Western Union, PayPal |
| Supply Ability: | 10000pcs/month |
| Tungsten: | 50% - 90% | Copper: | 10% - 50% |
|---|---|---|---|
| Sizes: | Customized | Application: | LED Heat Spreader Parts |
| Surface: | Blank, Ni Coated | Tolerance: | +/-0.05mm |
| Highlight: | 1.0mm Tungsten Copper Alloy Tablets,W80Cu20 Tungsten Copper Tablets,W90Cu10 0.1mm Tungsten Copper Alloy Tablets |
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Tablets Tungsten Copper Alloy Grade W80Cu20 W90Cu10 Thickness 0.1 - 1.0mm for LED
Tungsten copper alloy is the first choice for LED heat spreader parts. Thermal conductivity and thermal expansion characteristics of the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation.
Thermal expansion characteristics of tungsten copper alloy tablets similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper’s thermal conductivity and expansion characteristics, Tungsten copper tablets works well in densely packed circuits too.
Applicatioins of Tungsten Copper Tablets:
Advantages of Copper Tungsten Tablets:
High thermal conductivity
Strong hardness(86~93.5HRA)
High arc resistance combined with good electrical conductivity
Low thermal expansion.
Specifications of Tungsten Copper Alloy Tablets:
|
Material |
W90Cu10 |
W88Cu12 |
W85Cu15 |
W80Cu20 |
W75Cu25 |
|
Tungsten Content (wt%) |
90 ± 1 |
88 ± 1 |
85 ± 1 |
80 ± 1 |
75 ± 1 |
|
Density at 20°C (g/cm3) |
17.0 |
16.8 |
16.3 |
15.6 |
14.9 |
|
Coefficient of thermal expansion at 20°C (10-6/K) |
6.5 |
6.7 |
7.0 |
8.3 |
9.0 |
|
Code No. |
Chemical Composition % |
Mechanical properties |
||||||
|
CU |
Impurity |
W |
Density (g/cm3) |
Hardness HB |
RES(cm)
|
Conductivity IACS/ %
|
TRS/ Mpa
|
|
|
CuW(50) |
50+2.0 |
0.5 |
Balance |
11.85 |
115 |
3.2 |
54 |
|
|
CuW(55) |
45+ 2.0 |
0.5 |
Balance |
12.30 |
125 |
3.5 |
49 |
|
|
CuW(60) |
40+2.0 |
0.5 |
Balance |
12.75 |
140 |
3.7 |
47 |
|
|
CuW(65) |
35+2.0 |
0.5 |
Balance |
13.30 |
155 |
3.9 |
44 |
|
|
CuW(70) |
30+2.0 |
0.5 |
Balance |
13.80 |
175 |
4.1 |
42 |
790 |
|
CuW(75) |
25+2.0 |
0.5 |
Balance |
14.50 |
195 |
4.5 |
38 |
885 |
|
CuW(80) |
20+2.0 |
0.5 |
Balance |
15.15 |
220 |
5.0 |
34 |
980 |
|
CuW(85) |
15+2.0 |
0.5 |
Balance |
15.90 |
240 |
5.7 |
30 |
1080 |
|
CuW(90) |
10+2.0 |
0.5 |
Balance |
16.75 |
260 |
6.5 |
27 |
1160 |
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