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93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry

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93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry

93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry
93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry 93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry 93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry 93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry 93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry

Large Image :  93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry Get Best Price

Product Details:

Place of Origin: P.R. China
Brand Name: FOTMA
Certification: ISO9001:2008
Model Number: WCu Heat Sinks

Payment & Shipping Terms:

Minimum Order Quantity: 1 pcs
Price: Negotiable
Packaging Details: Paper cartons or plywood boxes
Delivery Time: 20-25 days after deposit
Payment Terms: T/T, L/C, Western Union, PayPal
Supply Ability: 10000pcs/month
Detailed Product Description
Tungsten: 75% Copper: 25%
Sizes: Customized Application: Heat Sinks For LED Products
Surface: Blank, Ni Coated Tolerance: +/-0.05mm
High Light:

93.5HRA Copper Tungsten Heat Sinks

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Ni Coated copper tungsten alloy

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FOTMA Copper Tungsten Heat Sinks

CuW75 Customized Tungsten Copper Alloy Heat Sinks WCu Spreader For LED Industry

 

The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, heat sinks, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized. 


The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper’s thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.

 

 

The thermal conductivity and thermal expansion characteristics of the semiconductor and the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation. The sketch shows the principle structure of a hermetically sealed electronic package.

  
Advantages of Copper Tungsten Heat Sinks / Spreaders:

 

Strong hardness(86~93.5HRA)
High arc resistance combined with good electrical conductivity
High thermal conductivity
Low thermal expansion.
 

Applicatioins of Tungsten Copper Alloy:

 

Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.

The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers,

 
Specifications of WCu Alloys:

 

Material

W90Cu10

W88Cu12

W85Cu15

W80Cu20

W75Cu25

Tungsten Content (wt%)

90 ± 1

88 ± 1

85 ± 1

80 ± 1

75 ± 1

Density at 20°C (g/cm3)

17.0

16.8

16.3

15.6

14.9

Coefficient of thermal expansion at 20°C (10-6/K)

6.5

6.7

7.0

8.3

9.0

 

Materials
(article name)

Composition
[wt%]

Density at 20°C
[g/cm2]

Coefficient of
thermal expansion at20°C
[10-6/K]

Thermal conductivity
at 20 °C
[W/(m·K)]

Molybdenum

Mo 99.97%

10.2

22°C5.5/800°C5.7

xyz142

Tungsten

W 99.95%

19.3

22°C4.5/800°C4.8

xyz165

MoCu

Mo-30% Cu

9.7

22°C7.1/800°C7.8

xyz205

WCu

W-10% Cu

17.1

22°C6.4

xyz195

WCu

W-15% Cu

16.4

22°C7.3

xyz215

WCu

W-20% Cu

15.5

22°C8.3

xyz235

Cu/Mo-30Cu/Cu
(PMC)

1:4:1 /
Mo-52%Cu

9.4

200°C9.0/800°C7.3

xy280/z170

Cu/Mo/Cu 
(CMC)

1:1:1 /
Mo-66%Cu

9.3

22°C8.3/800°C6.4

xy305/z250

Cu/Mo/Cu/.../Cu
(S-CMC)

5:1:5:1:5 /
Mo-87%Cu

9.2

200°C12.8/800°C6.1

xy350/z295


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93.5HRA Tungsten Copper Alloy Heat Sinks Ni Coated For LED Industry 0

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Contact Person: Pauline Zhou

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