Hubei Fotma Machinery Co., Ltd.
Tungsten, Molybdenum, Titanium, Tungsten Carbide and Investment Casting Products
| Place of Origin: | China |
|---|---|
| Brand Name: | FOTMA |
| Certification: | ISO9001: 2008 |
| Model Number: | Molybdenum Plate |
| Minimum Order Quantity: | 1 PC |
| Price: | Negotiable |
| Packaging Details: | Paper cartons or plywood boxes |
| Delivery Time: | 20-25 days after deposit |
| Payment Terms: | T/T, L/C, Western Union, PayPal |
| Supply Ability: | 10000pcs/month |
| Mo Content: | 99.95% | Density: | ≥ 10.2 G/cm3 |
|---|---|---|---|
| Tolerance: | +/- 0.02mm | Material Grade: | MoLa |
| Surface: | Black / Ground | Applications: | Vacuum Furnace Shielding |
| High Light: | MoLa 99.95% Ground Molybdenum Plate,MoLa 0.187 Inches Moly Sheet,0.187 Inches Ground Molybdenum Plate |
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High Temperature 99.95% Purity Ground Molybdenum Plate MoLa Plates/ Sheets for Furnace
The molybdenum plates' density is more than 10.2f/cm3. The surface roughness is less than 1.6 Ra. The purity is more than 99.95%. The application temperature environmemt is between 1600~1850.
The characteristics of the molybdenum plate
The high temperature molybdenum plates are from 0.187 inches to 3 inches in thickness is classified as molybdenum plate. It is widely used in the construction of furnace tooling and parts and as a feed stock for the fabrication of parts for the electronics and semiconductor industries.
Thanks to the properties of the molybdenum, they are useful in many high temperature applications where high melting points are required. Molybdenum also exhibits good strength at elevated temperatures making moly useful in furnace, aerospace and similar applications. And molybdenum plates' good thermal and electrical conductivity and low coefficient of expansion make it a useful metal in electronic/ electrical and glass-to-metal sealing applications.
The application of the molybdenum plate
Molybdenum plates are widely used as contact materials in silicon controlled rectifier diodes, transistors and thyristors mounting material for power semiconductor devices and heat sink bases.
Tolerance chart of ground molybdenum plate
|
Thickness |
Tol |
Width |
Tol |
Llength |
Tol |
Quality |
Flatness |
||
|
2.000 |
+/- 0.150 |
500.0 |
+/- 0.80 |
1000 |
+2/-0 |
hot rolled, pickled |
<1% |
||
|
3.000 |
+/- 0.300 |
400.0 |
+/- 0.80 |
800 |
+2/-0 |
hot rolled, pickled |
<1% |
||
|
5.000 |
+/- 0.200 |
400.0 |
+/- 1.00 |
700 |
+2/-0 |
hot rolled, pickled |
<1% |
||
|
10.000 |
+/- 0.500 |
400.0 |
+/- 1.50 |
500 |
+2/-0 |
hot rolled, pickled |
<1% |
||
|
20.000 |
+/- 1.000 |
350.0 |
+/- 1.50 |
500 |
+2/-0 |
hot rolled, pickled |
<1% |
|
|
|
30.000 |
+/- 1.000 |
350.0 |
+/- 1.50 |
500 |
+2/-0 |
hot rolled, pickled |
<1% |
|
|
|
40.000 |
+/- 1.000 |
300.0 |
+/- 1.50 |
400 |
+2/-0 |
hot rolled, pickled |
<1% |
|
|
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