Hubei Fotma Machinery Co., Ltd.
Tungsten, Molybdenum, Titanium, Tungsten Carbide and Investment Casting Products
| Place of Origin: | P.R. China |
|---|---|
| Brand Name: | FOTMA |
| Certification: | ISO9001:2008 |
| Model Number: | WCu Heat sink |
| Minimum Order Quantity: | 1 pcs |
| Price: | Negotiable |
| Packaging Details: | Paper cartons or plywood boxes |
| Delivery Time: | 20-25 days after deposit |
| Payment Terms: | T/T, L/C, Western Union, PayPal |
| Supply Ability: | 10000pcs/month |
| Tungsten: | 70% - 90% | Copper: | 10% - 30% |
|---|---|---|---|
| Sizes: | Customized | Application: | Heat Sinks, Contacts, For Making Switches And Contacts |
| Surface: | Blank, Ni Coated | Tolerance: | +/-0.05mm |
| High Light: | 86HRA Tungsten Copper Alloy,Arc Resistance Tungsten Copper Alloy,ISO9001 Tungsten Copper Alloy |
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Tungsten Copper Alloy Cubes used for Heat sink
Tungsten copper alloy is used extensively in thermal mounting plates, heat bases, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper’s thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.
The thermal conductivity and thermal expansion characteristics of the semiconductor and the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation. The sketch shows the principle structure of a hermetically sealed electronic package.
Applicatioins of Tungsten Copper Alloy:
Advantages of Copper Tungsten Heat sink:
Strong hardness(86~93.5HRA)
High arc resistance combined with good electrical conductivity
High thermal conductivity
Low thermal expansion.
Specifications of WCu Alloys:
|
Material |
W90Cu10 |
W88Cu12 |
W85Cu15 |
W80Cu20 |
W75Cu25 |
|
Tungsten Content (wt%) |
90 ± 1 |
88 ± 1 |
85 ± 1 |
80 ± 1 |
75 ± 1 |
|
Density at 20°C (g/cm3) |
17.0 |
16.8 |
16.3 |
15.6 |
14.9 |
|
Coefficient of thermal expansion at 20°C (10-6/K) |
6.5 |
6.7 |
7.0 |
8.3 |
9.0 |
|
Code No. |
Chemical Composition % |
Mechanical properties |
||||||
|
CU |
Impurity |
W |
Density (g/cm3) |
Hardness HB |
RES(cm)
|
Conductivity IACS/ %
|
TRS/ Mpa
|
|
|
CuW(50) |
50+2.0 |
0.5 |
Balance |
11.85 |
115 |
3.2 |
54 |
|
|
CuW(55) |
45+ 2.0 |
0.5 |
Balance |
12.30 |
125 |
3.5 |
49 |
|
|
CuW(60) |
40+2.0 |
0.5 |
Balance |
12.75 |
140 |
3.7 |
47 |
|
|
CuW(65) |
35+2.0 |
0.5 |
Balance |
13.30 |
155 |
3.9 |
44 |
|
|
CuW(70) |
30+2.0 |
0.5 |
Balance |
13.80 |
175 |
4.1 |
42 |
790 |
|
CuW(75) |
25+2.0 |
0.5 |
Balance |
14.50 |
195 |
4.5 |
38 |
885 |
|
CuW(80) |
20+2.0 |
0.5 |
Balance |
15.15 |
220 |
5.0 |
34 |
980 |
|
CuW(85) |
15+2.0 |
0.5 |
Balance |
15.90 |
240 |
5.7 |
30 |
1080 |
|
CuW(90) |
10+2.0 |
0.5 |
Balance |
16.75 |
260 |
6.5 |
27 |
1160 |
Picture show:
